FPC / Rigid-Flex (mooglikheden)
Stevige PCB (mooglikheden)
FPC / Rigid-Flex (mooglikheden)
| Laach telle | 1-28 lagen |  |
| Laminaten type | FR-4 (Heech Tg, Halogeenfrij, Hege frekwinsje) PTFE, BT, Getek, Aluminiumbasis ， Koperbasis ， KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Board dikte | 6-240mil | |
| Max Base koper gewicht | 210um (6oz) foar binnenlaach 210um (6oz) foar bûtenlaach | |
| Min meganyske boargrutte | 0,2 mm (0,008 ″) | |
| Aspektferhâlding | 12: 1 | |
| Maksimum panielgrutte | Sigle side as dûbele kanten: 500mm * 1200mm, | |
| Mearlaags lagen: 508mm X 610mm (20 ″ X 24 ″) | ||
| Min rigelbreedte / spaasje | 0,076mm / 0,076mm (0,003 ″ / 0,003 ″) / 3mil / 3mil | |
| Fia gattype | Blyn / begroeven / ynstútsenComment (VOP, VIP…) | |
| HDI / Microvia | JA | |
| Oerflakte ôfwurking | HASL | |
| Lead Free HASL | ||
| Immersion Gold (ENIG), Immersion Tin, Immersion Silver | ||
| Organic Solderability Conservative (OSP) / ENTEK | ||
| Flitsgoud (hurde gouden platen) | ||
| ENEPIG | ||
| Selektyf gouden platen, gouddikte oant 3um (120u ”) | ||
| Gouden finger, koalstofôfdruk, skille S / M | ||
| Solder masker kleur | Grien, blau, wyt, swart, helder, ensfh. | |
| Impedânsje | Ien spoar, differinsjaal, coplanare impedânsje kontroleare ± 10% | |
| Outline finishtype | CNC Routing; V-Skoaren / Knippe; Ponsje | |
| Tolerânsje | Min gat tolerânsje (NPTH) ± 0,05 mm | |
| Min gat tolerânsje (PTH) ± 0,075 mm | ||
| Min Patroan tolerânsje ± 0,05 mm |
Stevige PCB (mooglikheden)
| Sortearje | Ûnderdiel | Bekwamens |  |
|
| Laach telle | Rigid-flex PCB | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Board | Min. Dikte | 0,08 +/- 0,03 mm | ||
| Max. Dikte | 6mm | |||
| Max. Grutte | 485mm * 1000mm | |||
| Gat & Slot | Min.Hole | 0,15 mm | ||
| Min.Slot gat | 0.6mm | |||
| Aspektferhâlding | 10: 1 | |||
| Trace | Min.Breedte / romte | 0,05 / 0,05 mm | ||
| Tolerânsje | Trace W / S | ± 0,03 mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Gat nei gat | ± 0,075 mm | |||
| Hole Dimension | ± 0,075 mm | |||
| Impedânsje | 0 ≤ Wearde ≤ 50Ω: ± 5Ω 50Ω ≤ Wearde: ± 10% Ω | |||
| Materiaal | Basefilm Spesifikaasje | PI: 3mil 2mil 1mil 0,8mil 0,5mil | ||
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Main leveransier | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Coverlay Spesifikaasje | PI: 2mil 1mil 0,5mil | |||
| LPI Kleur | Grien / Giel / Wyt / Swart / Blau / Read | |||
| PI Stiffener | T: 25um ～ 250um | |||
| FR4 Stiffener | T: 100um ～ 2000um | |||
| SUS Stiffener | T: 100um ～ 400um | |||
| AL Stiffener | T: 100um ～ 1600um | |||
| Tape | 3M / Tesa / Nitto | |||
| EMI-ôfskerming | Sulveren film / Koper / Sulveren inket | |||
| Oerflakte ôfwurking | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed fergees) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| Plating hurd goud | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Flitsgoud | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0,015um - 0,10um | ||||
| Immesion sulver | Ag: 0.1 - 0.3um | |||
| Plating Tin | Sn: 5um - 35um | |||